5200T robust solderability testing platform is renowned for its superior build quality and exceptional performance.
5200T has been designed to integrate with the widest range of method for solderability testing.Our development is in a bid to lessen the burden of the user, and they take a good repeatability. The unique design of the 5200T allows state-of-the-art performance without requiring study for solderability testing technique.

CSR5000 NANO LAYER SCRATCH TESTER is useful for evaluate for thin films like that DLC , TiN , ITO, CrN and optical parts.We can measure and determination adhesion strength between thin films less than 1 micron and substrates using Micro scratch method. You can gets the evaluation outputs for the critical point of films fracture.

PTR1102 BONDING TESTER is simple and robust equipment for using wire pull test and die share test. RHESCA already much equipment installed in Japanese enterprises and their oversea facilities by ourselves.

TAC1000 Pressure-Sensitive Tack of Adhesive Test equipment, measure adhesion of solder paste, tape and other adhesive materials. This method is to measure the adhesive force by pressuring and separating the adhesive side of samples, using the probe.